We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.
| Classification | Double Components Adhesives | Usage | Electronic components, circuit boards, inverters |
| Main Raw Material | Epoxy | EINECS No. | 00-00 |
| CAS No. | 00-00 | MF | N/A |
| Other Names | Epoxy Potting Adhesive | Type | Double component epoxy sealant |
| Characteristic 1 | Hardness Shore D 90, low viscosity, high permeability | Characteristic 2 | High hardness, smooth surface, waterproof and oil resistant |
| Characteristic 3 | Corrosion resistant, UL94V-0 flame retardant | Characteristic 4 | Epoxy resin material, low curing stress |
| Characteristic 5 | High hardness, aging resistance, impact resistance | Application scenarios | Used for potting protection of electronic components, circuit boards |
| Application scenarios 1 | Used for sealing filters, transformers, and LED power supplies | Application scenarios 2 | Used for potting AC capacitors and sensor products |