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Two Component Epoxy Potting Compound Low Viscosity Thermal Conductivity 0.3 W m.K Dielectric Strength 19 KV mm

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Two Component Epoxy Potting Compound Low Viscosity Thermal Conductivity 0.3 W m.K Dielectric Strength 19 KV mm

Name: Two Component Epoxy Potting Compound Low Viscosity Thermal Conductivity 0.3 W m.K Dielectric Strength 19 KV mm - Rensino Chemical Industrial Co., Ltd
SKU: ER-6168

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Classification	Double Components Adhesives	Usage	Electronic Components
Main Raw Material	Epoxy Resin	EINECS No.	500-033-5
CAS No.	25068-38-6	Other Names	Epoxy Potting Compound
Type	Two-Component	Material Type	Two-component Epoxy Resin
Mixing Ratio	5:1 (A:B by Weight)	Density after mixing	1.65±0.05 g/cm3
Hardness (Shore D)	85 ± 5 D	Mixed Viscosity	1000-2000 mPa.s
Thermal Conductivity	≥0.3 W/m.K	Dielectric Strength	19 kV/mm
Service Temperature	-50°C to 120°C	Volume Shrinkage	0.89%
Compliance	RoHS, REACH, VOC Certified

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