other
9216F APG Epoxy Resin Potting Compound for Electricity Insulation Parts Usage
Home  /  Products  /  9216F APG Epoxy Resin Potting Compound for Electricity Insulation Parts Usage

9216F APG Epoxy Resin Potting Compound for Electricity Insulation Parts Usage

  • Product Detail
We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageElectrical insulation
Main Raw MaterialEpoxyEINECS No.216-823-5
CAS No.1675-54-3MFC21H24O4
Other NamesEpoxy resin potting compoundTypeEpoxy Resin Compound
KeywordsEpoxy Resin Liquid
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)
Related Products
Details
High Glossy Bubble Free Epoxy Resin Liquid Glue for Wood Table Top Furniture Adhesive Versatile for Packing Sticker Application

Classification Double Components Adhesives Usage Construction, DIY handmade Main Raw Material Epoxy EINECS No. 224-221-9 CAS No. 4253-34-3 MF NONE Product name Epoxy AB Glue Application DIY Crafts Material Epoxy Resin Color Transparent Keywords 1:1 epoxy resin ab glue MOQ 100 sets Feature Eco-friendly Volume 498ml Shelf life 12 Months Packing Carton

Details
C12 14 Fatty Alcohol Polyoxyethylene Ether AEO 15 CAS No. 9002 92 0

Usage Surfactants Type Carbon Black Purity 99% Classification Chemical Auxiliary Agent MF C12~14H25~29O.(C2H4O)n CAS No. 9002-92-0 Other Names C12-14 Fatty alcohol polyoxyethylene ether Appearance (25℃) Colorless liquid Colour (Pt-Co) ≤40 Hydroxyl value 62~72 mgKOH/g PH 5-7 Cloud point (℃) 80~88*(5%NaCl)

Details
Highly Transparent Potting Adhesive Epoxy Resin Crystal Glue Electronic Sealing Liquid Silicone Heat Dissipation for Sealed

Application Sealed electronic components Feature Highly transparent, electronic sealing, heat dissipation Grade Qualified Product

Details
Manufacturer High Quality Epoxy Board Potting Sealant Electronic Grade Resin for Battery

Classification Double Components Adhesives Usage Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking Main Raw Material Epoxy EINECS No. 210-898-8 CAS No. 7085-85-0 MF Mixture Other Names strong adhesive ab epoxy glue Type Two Component Product name Epoxy sealant Application Industry Feature High Temperature Resistance Material Epoxy Resin+hardener

Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)

Home

Products

about

contact