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SS259P High Performance Two Component Thermally Conductive Silicone Gap Filler 9.5W m.k Thermal Adhesives Sealants
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SS259P High Performance Two Component Thermally Conductive Silicone Gap Filler 9.5W m.k Thermal Adhesives Sealants

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationOther AdhesivesUsageConstruction, Transportation, Energy storage industry
Main Raw MaterialSiliconeEINECS No.210-898-8
CAS No.9009-54-5MFCH3H8N2O
Other NamesTwo component polyurethane adhesiveTypeTwo component
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