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High Adhesion Thermal Interface Material with Low Thermal Expansion and Excellent Flow Epoxy Potting Compound for Power Modules
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High Adhesion Thermal Interface Material with Low Thermal Expansion and Excellent Flow Epoxy Potting Compound for Power Modules

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageTransportation, Electronics & power module,LED driver,luminaires
Main Raw MaterialEpoxyCAS No.NA
MFMIXTUREOther NamesV0 Epoxy thermal conductive potting adhesive
TypeEpoxy resin thermal conductivity potting adhesiveProduct nameHardness Epoxy thermal conductivity potting adhesive
MaterialEpoxy resin,composite ceramic powderApplicationElectronics & power module,LED luminaires
KeywordsEpoxy resin thermal conductivity potting adhesiveStorage condition≤23℃
Density1.9 g/cm³Thermal conductivity1.0W/(mk)
Advantageheat conduction,Good flame retardancy ,waterproof,Shelf life≤23℃6 months
MOQ1 KG
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