what are you looking for?
other
High Quality High Thermal Conductivity Two Component Thermal Paste Epoxy for CPU Computer and Woodworking
Home  /  Products  /  High Quality High Thermal Conductivity Two Component Thermal Paste Epoxy for CPU Computer and Woodworking

High Quality High Thermal Conductivity Two Component Thermal Paste Epoxy for CPU Computer and Woodworking

Inquire Now
Categories
  • Product Detail
We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationHot Melt AdhesivesUsageConstruction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking
Main Raw MaterialEpoxyEINECS No.231-545-4
CAS No.67763-03-05MFmSiO2 nH2O
Other Namesconductivity silicone greaseTypeTwo Component
ColorWhiteAdvantageSuitable High Temperate Climates
Viscosity40000-45000CertificateRoHS
MOQ1 KGPackageBottle
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)
Related Products
Details
Heat Resistance and Strong Acid Resistance Modified Novolac Epoxy Resin F44 for Casting Materials

Classification Other Adhesives Usage Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking Main Raw Material Epoxy EINECS No. 208-750-2 CAS No. 28064-14-4 MF CH2-CHCl-]n Other Names phenolic epoxy resin Type epoxy resin Appearance Light Yellow Viscous Liquid Epoxy value eq/100g 0.50~0.57 Softening point ℃ 30~40

Details
EPotting 2150 1.5 W Epoxy Thermal Conductivity Glue Clear Liquid LED Low Heat Thermal Interface Material

Usage Transportation, LED lamps and lighting assembly Main Raw Material Epoxy resin EINECS No. N/A CAS No. MIXTURE MF MIXTURE Other Names CR TM EPotting-2150 Type Two-component Other Names Thermal Potting Adhesive Logo Jinghe Material Epoxy resin Thermal conductivity 1.5 W/(mK) Density@ Cured 1.9 g/cm³ Appearance Dark grey fluid & Translucent fluid Type Two-part Usage […]

Details
Heat Dissipation Confidential Encapsulation Epoxy Resin for Electronic Components Potting 5:1 Self Leveling Epoxy AB Resin

Classification Double Components Adhesives Usage Woodworking, Construction Main Raw Material Epoxy EINECS No. 500-033-5 CAS No. 9082-00-2 MF C15H16O2C2H7ONC3H5OCl Other Names Epoxy Resin AB Glue Type Epoxy Resin for Electronic Components Potting Mixing Ratio A:B=5:1 Color Black Application Epoxy Resin for Electronic Components Potting Material Epoxy Resin+Hardener Keywords Epoxy Resin Liquid Feature Eco-friendly Shelf life […]

Details
UV CIPP No Styrene Bisphenol A Epoxy Modified Vinyl Ester Resin Polymer Resin Phorise E 7105

Product Type Synthetic Resin And Plastics CAS No. 37943-62-9 Purity 42.0-48.0 % Appearance Transparent, slightly turbid liquid Viscosity 500-700 mPa.s Solid Content 57.0-63.0 %
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)

Home

Products

about

contact