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EPotting 2150 1.5 W Epoxy Thermal Conductivity Glue Clear Liquid LED Low Heat Thermal Interface Material
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EPotting 2150 1.5 W Epoxy Thermal Conductivity Glue Clear Liquid LED Low Heat Thermal Interface Material

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

UsageTransportation, LED lamps and lighting assemblyMain Raw MaterialEpoxy resin
EINECS No.N/ACAS No.MIXTURE
MFMIXTUREOther NamesCR TM EPotting-2150
TypeTwo-componentOther NamesThermal Potting Adhesive
LogoJingheMaterialEpoxy resin
Thermal conductivity1.5 W/(mK)Density@ Cured1.9 g/cm³
AppearanceDark grey fluid & Translucent fluidTypeTwo-part
UsagePhotovoltaic moduleRoHSPass
Shelf life@ ≤23℃12months
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