other
Hardness 1 1 Black Epoxy Resin Self Leveling Two Component with Yellowing Resistance for Electronic Components Potting
Home  /  Products  /  Hardness 1 1 Black Epoxy Resin Self Leveling Two Component with Yellowing Resistance for Electronic Components Potting

Hardness 1 1 Black Epoxy Resin Self Leveling Two Component with Yellowing Resistance for Electronic Components Potting

  • Product Detail
We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageElectronics
Main Raw MaterialSiliconeEINECS No.24004253102
CAS No.67762-94-1Other NamesThermal Conductive Potting Compound
TypeThermal Conductive GlueMain MaterialVinyl polysiloxane
ApplicationElectrical insulating,LED potting,Automotive,Battery,Pv junction boxFeatureHigt thermal conductivity,Insulation
AdvantageNon-toxic,High-temperature resistance,Chemical resistanceShelf life6 Months
MOQ100kgMixing RatioA:B=1:1
OEM/ODMSupportCuring time2min(100℃),15~30min(80℃)
Curing systemRoom Temperature/Heat Curing Addition Molded Silicone Materials
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)
Related Products
Details
Manufacturers Heat Conductive Electronic Seal High Hardness Epoxy Resin Potting Adhesive AB Adhesive

Classification Double Components Adhesives Usage PU /Epoxy potting Main Raw Material Epoxy EINECS No. 231-545-4 CAS No. 7085-85-0 MF mSiO2 nH2O Other Names Double Components Adhesives Type Liquid Color Black Application electronic components Shelf life 12 Months Epoxy Keywords Epoxy AB Resin Epoxy Certificate ROHS Epoxy Feature Moisture-proof, electrical insulation Mixing ratio (by weight) A:B=5:1

Details
Electronic Epoxy Resin For Potting

Classification Double Components Adhesives Usage Construction, electronics Main Raw Material Silicone Other Names epoxy encapsulants hardness 80Shore D conductivity factor 0.4W/mK water absorption <0.1 24h,25°C,% dielectric strength >20 kV/mm(25°C) Loss factor 0.014(1MHz)(25°C) dielectric constant 3.53(1MHz)(25°C) curing time 80/1.5 or 25/10 °C/hr operation time 40min(25°C) Mixture density 1.57g/cm3(25°C) Mixed viscosity 700-1200mPa*s(25°C)

Details
Epoxy Resin Set 2:1 Pouring Wood Art River Dining Coffee Table Top Epoxy Resin Material From The Source Factory

Classification Double Components Adhesives Usage Construction, Fiber & Garment, Woodworking Main Raw Material Epoxy CAS No. 61788-97-4 MF [-O-CH2-CH2-O-] Other Names epoxy resin crystal clear Type liquild Application Deep Pour DIY Crafts wood table coating Color Transparent Material Epoxy Resin+curing Hardner Appearance Transparent Colorless Liquid

Details
Liquid Cast Crystal Clear Wood Deep Pour River Table Epoxy Resin Table Top Epoxy Products Adhesives Sealants

Classification Double Components Adhesives Usage Construction, Packing, Woodworking, Liquids wood deep pour epoxy resin Main Raw Material Epoxy EINECS No. 231-072-3 CAS No. 38891-59-7 Other Names Liquids Cast wood deep pour epoxy resin Type Liquid epoxy resin Usage Woodworking,or large potting and casting Type Liquid Glue Product name Epoxy Hardener Application range Deep pour and […]

Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)

Home

Products

about

contact