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Electronic Epoxy Resin For Potting
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Electronic Epoxy Resin For Potting

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageConstruction, electronics
Main Raw MaterialSiliconeOther Namesepoxy encapsulants
hardness80Shore Dconductivity factor0.4W/mK
water absorption<0.1 24h,25°C,%dielectric strength>20 kV/mm(25°C)
Loss factor0.014(1MHz)(25°C)dielectric constant3.53(1MHz)(25°C)
curing time80/1.5 or 25/10 °C/hroperation time40min(25°C)
Mixture density1.57g/cm3(25°C)Mixed viscosity700-1200mPa*s(25°C)
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