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Manufacturers Heat Conductive Electronic Seal High Hardness Epoxy Resin Potting Adhesive AB Adhesive

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Manufacturers Heat Conductive Electronic Seal High Hardness Epoxy Resin Potting Adhesive AB Adhesive

Name: Manufacturers Heat Conductive Electronic Seal High Hardness Epoxy Resin Potting Adhesive AB Adhesive - Rensino Chemical Industrial Co., Ltd
SKU: ER-3596

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Double Components Adhesives	Usage	PU /Epoxy potting
Main Raw Material	Epoxy	EINECS No.	231-545-4
CAS No.	7085-85-0	MF	mSiO2 nH2O
Other Names	Double Components Adhesives	Type	Liquid
Color	Black	Application	electronic components
Shelf life	12 Months	Epoxy Keywords	Epoxy AB Resin
Epoxy Certificate	ROHS	Epoxy Feature	Moisture-proof, electrical insulation
Mixing ratio (by weight)	A:B=5:1

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