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Two-Component Conductive Adhesive High Thermal Conductivity High Adhesion Conductive Epoxy for Semiconductor Target Bonding

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Two-Component Conductive Adhesive High Thermal Conductivity High Adhesion Conductive Epoxy for Semiconductor Target Bonding

Name: Two-Component Conductive Adhesive High Thermal Conductivity High Adhesion Conductive Epoxy for Semiconductor Target Bonding - Rensino Chemical Industrial Co., Ltd
SKU: ER-3601

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Double Components Adhesives	Usage	Transportation, Target binding
Main Raw Material	Epoxy	CAS No.	N/A
MF	Mixture	Other Names	Epoxy modified thermally and electrically conducti
Type	Two component	Product name	Epoxy modified thermally and electrically conducti
Material	Epoxy adhesives	Appearance	A:Black paste& B:Light yellow liquid
Viscosity A&B	40000 cps	Component	Two-part
Part A& Part B	Epoxy modified resin & Curing agent	Mixing Ratio	A:B=10:1(By Weight)
Hardness shore D	65±5	Shelf life@ <10℃	6 months
Application	Target binding

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