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Epoxy Modified Electrically Conductive Adhesive 2.5 W/m.k EMI Shielding Target Bonding for Sputtering Applications

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Epoxy Modified Electrically Conductive Adhesive 2.5 W/m.k EMI Shielding Target Bonding for Sputtering Applications

Name: Epoxy Modified Electrically Conductive Adhesive 2.5 W/m.k EMI Shielding Target Bonding for Sputtering Applications - Rensino Chemical Industrial Co., Ltd
SKU: ER-3593

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Classification	Double Components Adhesives	Usage	Transportation, Target binding
Main Raw Material	Epoxy	CAS No.	N/A
MF	Mixture	Other Names	Epoxy modified thermally and electrically conducti
Type	Two component	Product name	Epoxy modified thermally and electrically conducti
Material	Epoxy adhesives	Appearance	A:Black paste& B:Light yellow liquid
Viscosity A&B	40000 cps	Component	Two-part
Part A& Part B	Epoxy modified resin & Curing agent	Mixing Ratio	A:B=10:1(By Weight)
Hardness shore D	65±5	Shelf life@ <10℃	6 months
Application	Target binding

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