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Modified Epoxy Underfill for CSP BGA Packaging UV and Thermal Curing for E paper ESL and Smart Card Applications
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Modified Epoxy Underfill for CSP BGA Packaging UV and Thermal Curing for E paper ESL and Smart Card Applications

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationHot Melt AdhesivesUsageUV & Thermal Curing in E-paper, ESL, Smart Card Applications
Main Raw MaterialPolyurethaneEINECS No.other
CAS No.otherOther NamesThermosetting Encapsulant
TypeAdhesives & SealantsProduct nameEpoxy Underfill Adhesive
ColorblackMaterialmodified resin
Shelf life6 MonthsOEMAccept
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