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High Thermal Conductivity Black Two Component Epoxy Potting Sealant for Construction Electronic Components

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High Thermal Conductivity Black Two Component Epoxy Potting Sealant for Construction Electronic Components

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Classification	Other Adhesives	Usage	Construction, Transportation, Woodworking
Main Raw Material	Epoxy	EINECS No.	210-898-8
CAS No.	61788-97-4	MF	C21H23ClFNO2
Other Names	Epoxy potting sealant	Type	Two component Epoxy potting sealant
Product name	Epoxy potting sealant	Color	Black
Application	Encapsulating and potting of flame retardant	OEM & ODM	Yes, OEM & ODM are Welcome
Packing	25 drum	Advantage	High Quality & Competitive price
Delivery time	10-20days	MOQ	1000kg
Shelf	12months	Thermal Conductivity	0.6w/mk

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