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Classification Double Components Adhesives Usage embedding electronic components Main Raw Material Epoxy EINECS No. 500-033-5 CAS No. 38891-59-7 MF C15H16O2 C2H7O Other Names epoxy potting compound Type Two-components Product name Two-Component epoxy potting compound Application electronic components Feature self-leveling Advantage aging resisitance,moisture resistance,insulation Keywords electronic adhesive Function High Adhesion Strength Full curing time (h) 48 […]

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Classification Double Components Adhesives Usage Construction Main Raw Material Epoxy EINECS No. 231-545-4 CAS No. 9009-54-5 MF C7H8OSi)m.(C2H6OSi)n Other Names Polyurethane Foam Type structural adhesive resin modified epoxy resin Application construction projects Type Two Component Certificate Test Report Etc Packing Cartridge Shelf life 12months MOQ 100 Color dark green Curing Time 1 hour Package carton

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Classification Double Components Adhesives Usage Construction Main Raw Material Epoxy Other Names Epoxy AB Glue Type Epoxy Structural Adhesive Product name Epoxy AB Glue Color/PartA Natural Color/PartB Red Mix Ratio 1:1 Tensile strength 10.96 Mpa Shelflife@25℃ 6 months Cure @25℃ 48 hrs Cure@100℃ 150 min Thermal Conductivity 3 W/mK Breakdown strength 18.26 kV/mm

Details

Usage Transportation, LED lamps and lighting assembly Main Raw Material Epoxy resin EINECS No. N/A CAS No. MIXTURE MF MIXTURE Other Names CR TM EPotting-2150 Type Two-component Other Names Thermal Potting Adhesive Logo Jinghe Material Epoxy resin Thermal conductivity 1.5 W/(mK) Density@ Cured 1.9 g/cm³ Appearance Dark grey fluid & Translucent fluid Type Two-part Usage […]