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Thermal Conductive Potting Compound FHD EP2530 Epoxy Adhesive 1 1 Ratio Cooling Plate Bonding 48H Cure Time
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Thermal Conductive Potting Compound FHD EP2530 Epoxy Adhesive 1 1 Ratio Cooling Plate Bonding 48H Cure Time

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageConstruction
Main Raw MaterialEpoxyOther NamesEpoxy AB Glue
TypeEpoxy Structural AdhesiveProduct nameEpoxy AB Glue
Color/PartANaturalColor/PartBRed
Mix Ratio1:1Tensile strength10.96 Mpa
Shelflife@25℃6 monthsCure @25℃48 hrs
Cure@100℃150 minThermal Conductivity3 W/mK
Breakdown strength18.26 kV/mm
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