what are you looking for?
other
Trial Size SIRNICE Epoxy Potting Compound 6kg Set Shore D85 RoHS REACH Certified Thermal Conductivity 0.3 W m.K PCB
Home  /  Products  /  Trial Size SIRNICE Epoxy Potting Compound 6kg Set Shore D85 RoHS REACH Certified Thermal Conductivity 0.3 W m.K PCB

Trial Size SIRNICE Epoxy Potting Compound 6kg Set Shore D85 RoHS REACH Certified Thermal Conductivity 0.3 W m.K PCB

Inquire Now
Categories
  • Product Detail
We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageElectronic Components
Main Raw MaterialEpoxy ResinEINECS No.500-033-5
CAS No.25068-38-6Other NamesEpoxy Potting Compound
TypeTwo-ComponentMaterial TypeTwo-component Epoxy Resin
Mixing Ratio5:1 (A:B by Weight)Density after mixing1.65±0.05 g/cm3
Hardness (Shore D)85 ± 5 DMixed Viscosity1000-2000 mPa.s
Thermal Conductivity≥0.3 W/m.KDielectric Strength19 kV/mm
Service Temperature-50°C to 120°CVolume Shrinkage0.89%
ComplianceRoHS, REACH, VOC Certified
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)
Related Products
Details
110ml E6000 Multipurpose DIY Acrylic Epoxy Resin Glue for Mobile Phone and Jewelry Repair and Rhinestones

Classification Other Adhesives Usage Transportation Main Raw Material Acrylic EINECS No. 7085-85-0 CAS No. 7085-85-0 MF N/A Other Names E6000 Type Pressure Sensitive Adhesives

Details
Room Temperature Curing Epoxy Encapsulant High Thermal Conductivity Low Stress Potting Compound for LED Lighting Assembly

Classification Double Components Adhesives Usage Transportation, Electronics & power module,LED driver,luminaires Main Raw Material Epoxy CAS No. NA MF MIXTURE Other Names V0 Epoxy thermal conductive potting adhesive Type Epoxy resin thermal conductivity potting adhesive Product name Hardness Epoxy thermal conductivity potting adhesive Material Epoxy resin,composite ceramic powder Color Dark grey and white Application Electronics […]

Details
Two Components Sealant Tile Gap Filling Epoxy Joint Filler Grout

Classification Other Adhesives Usage Construction, For Joint Filling Main Raw Material cement, sand, HPMC, and other additive EINECS No. 203-492-7 CAS No. 63148-52-7 MF Mixture Other Names tile joint filler Type two part Product name Two Components Sealant Tile Gap Filling Epoxy Joint Filler Grout Color Multiple colors: white, grey, cream, black, brown, red, etc. […]

Details
9216F APG Epoxy Resin Potting Compound for Electricity Insulation Parts Usage

Classification Double Components Adhesives Usage Electrical insulation Main Raw Material Epoxy EINECS No. 216-823-5 CAS No. 1675-54-3 MF C21H24O4 Other Names Epoxy resin potting compound Type Epoxy Resin Compound Keywords Epoxy Resin Liquid
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)

Home

Products

about

contact