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Room Temperature Curing Epoxy Encapsulant High Thermal Conductivity Low Stress Potting Compound for LED Lighting Assembly
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Room Temperature Curing Epoxy Encapsulant High Thermal Conductivity Low Stress Potting Compound for LED Lighting Assembly

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageTransportation, Electronics & power module,LED driver,luminaires
Main Raw MaterialEpoxyCAS No.NA
MFMIXTUREOther NamesV0 Epoxy thermal conductive potting adhesive
TypeEpoxy resin thermal conductivity potting adhesiveProduct nameHardness Epoxy thermal conductivity potting adhesive
MaterialEpoxy resin,composite ceramic powderColorDark grey and white
ApplicationElectronics & power module,LED luminairesKeywordsEpoxy resin thermal conductivity potting adhesive
Storage condition≤23℃Density1.9 g/cm³
Thermal conductivity1.0W/(mk)Advantageheat conduction,Good flame retardancy ,waterproof,
Shelf life≤23℃6 months
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