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Two-Component Insulation Thermal Conductive Gel 2.0 W/mk High Conductivity Thermal Gel for PCB Applications
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Two-Component Insulation Thermal Conductive Gel 2.0 W/mk High Conductivity Thermal Gel for PCB Applications

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationOther AdhesivesUsageHigh Temperature
Main Raw MaterialSiliconeEINECS No.UV Resin Kit
CAS No.resin diy kitMFMixture
Other NamesOne part liquid gap fillerTypeTwo Component
ApplicationElectronic equipment heat conductionUseWireless device,Automotive electronics
ColorBlue/white/pinkDensity2.5-3.2g/cm3
Thermal Conductivity2.0-8 W/mkBreakdown voltage≥6kv
Shelf life≤23℃12 monthsProduct nameSilicone Sealant Glue
KeywordsEpoxy Resin LiquidFeatureEco-friendly
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