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Two Component Epoxy Potting Compound for Electronic Parts High Hardness Low Shrinkage Waterproof Insulation Glue
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Two Component Epoxy Potting Compound for Electronic Parts High Hardness Low Shrinkage Waterproof Insulation Glue

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageConstruction + Electronics
Main Raw MaterialEpoxyProduct nameEpoxy Potting Glue
KeywordsEpoxy adhesive seriesApplicationPower supply, transformer, PCB circuit board
Factory advantageStable outputAdvantageExcellent adhesion performance, Available for repacking
Delivery time7-15 DaysOne set50kg
Test ReportRoHS,FDA,REACH,TSCA,Content per set25kg per Component A & Component B per set
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