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Thermal Conductive Two Part Epoxy Resin AB Glue Heat Dissipation Waterproof Adhesive for Transformer and Circuit Board

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Thermal Conductive Two Part Epoxy Resin AB Glue Heat Dissipation Waterproof Adhesive for Transformer and Circuit Board

Name: Thermal Conductive Two Part Epoxy Resin AB Glue Heat Dissipation Waterproof Adhesive for Transformer and Circuit Board - Rensino Chemical Industrial Co., Ltd
SKU: ER-7230

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Classification	Double Components Adhesives	Main Raw Material	Epoxy
EINECS No.	231-545-4	CAS No.	67763-03-05
MF	mSiO2 nH2O	Other Names	Epoxy quick-drying adhesive
Type	Two Component	Product name	Electronic-pouring sealant
Application	Sealing Construction	Keywords	electronic potting glue
Viscosity	1500-2000	Advantage	Suitable High Temperate Climates
Color	Transparent	Material	Pure Epoxy
MOQ	1 KG	Certificate	rohs
Packing	Bottle

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