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Potting Compound Electronics Filling Liquid AB Glue Adhesive Fire Proof Mold Proof Sealant Industrial Epoxy Resin and Hardener
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Potting Compound Electronics Filling Liquid AB Glue Adhesive Fire Proof Mold Proof Sealant Industrial Epoxy Resin and Hardener

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageelectronic circuit
Main Raw MaterialEpoxyEINECS No.000
CAS No.38891-59-7Other NamesEpoxy Resin and Hardener
TypeEpoxy Potting Compound Circuit BoardsProduct nameEpoxy AB Glue
Colortransparent colourShelf life6 Months
KeywordsEpoxy Resin LiquidPackageCustomized Package
CertificateMSDS RoHSFeatureHigh temperature resistance/Impact resistance
Proportion100:20
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