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Two-component Potting Adhesive Silicone Resin Liquid for Encapsulating Electronic Components Central Processing Unit AB Glue
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Two-component Potting Adhesive Silicone Resin Liquid for Encapsulating Electronic Components Central Processing Unit AB Glue

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageElectric power
Main Raw MaterialSiliconeEINECS No.no
CAS No.noMFno
Other NamesAB AdhesiveTypeLiquid glue
Mixing ratio1:1Flame rete (UL)V0
MaterialSiliconeThermal conductivity1.0w/m.k-3w/m.k (Support customized)
Appearance/ColorFluid in color A (gray) / color B (white)Curing ConditionsCure at room temperature/by heating
FeatureLow Viscosity, good leveling, seismic, good fire resistanceStorage methodIn a cool place below 25℃
Certification certificateComply with EU ROHS and REACH standardsKeywordSilicone Potting Compound Adhesive
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