what are you looking for?

Modified Epoxy Underfill for CSP BGA Packaging UV and Thermal Curing for E paper ESL and Smart Card Applications

Home / Products / Modified Epoxy Underfill for CSP BGA Packaging UV and Thermal Curing for E paper ESL and Smart Card Applications

Modified Epoxy Underfill for CSP BGA Packaging UV and Thermal Curing for E paper ESL and Smart Card Applications

Name: Modified Epoxy Underfill for CSP BGA Packaging UV and Thermal Curing for E paper ESL and Smart Card Applications - Rensino Chemical Industrial Co., Ltd
SKU: ER-3624

Inquire Now

Categories

how can we help you

You can contact us any way that is convenient for you. We are available 24/7 via email or telephone.

Product Detail

We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Hot Melt Adhesives	Usage	UV & Thermal Curing in E-paper, ESL, Smart Card Applications
Main Raw Material	Polyurethane	EINECS No.	other
CAS No.	other	Other Names	Thermosetting Encapsulant
Type	Adhesives & Sealants	Product name	Epoxy Underfill Adhesive
Color	black	Material	modified resin
Shelf life	6 Months	OEM	Accept

Leave A Message

If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.

Contact Form (#3)

First Name

Last Name

Phone/WhatsApp

Country

Message

Related Products

Details

Chameleon Pearl Chromium Epoxy Resin Pigment Coating for Resin Art Crafts Leather Pigments

Usage Ceramic Pigments, Coating Pigment, Cosmetic Pigment, Ink Pigments, Plastic & Rubber Pigment, Leather Pigments Type Chromium Style Inorganic Pigment MF Mica/Fe3O4 CAS No. 310-127-6 EINECS No. 310-127-6 Other Names Synthetic Iron Oxide Product name Dynamic color change Color Multi Color Particle size 9-18um/25-35um Ingredients SiO2/Fe2O3/Intert metal Certification MSDS IS09001 Reach COA MOQ 100 g […]

Details

Liquid Cast Crystal Clear Wood Deep Pour River Table Epoxy Resin Table Top Epoxy Products Adhesives Sealants

Classification Double Components Adhesives Usage Construction, Packing, Woodworking, Liquids wood deep pour epoxy resin Main Raw Material Epoxy EINECS No. 231-072-3 CAS No. 38891-59-7 Other Names Liquids Cast wood deep pour epoxy resin Type Liquid epoxy resin Usage Woodworking,or large potting and casting Type Liquid Glue Product name Epoxy Hardener Application range Deep pour and […]

Details

Epoxy Modified Conductive Adhesive Two-Component Target Bonding Conductive Epoxy for Semiconductor EMI Shielding

Classification Double Components Adhesives Usage Transportation, Target binding Main Raw Material Epoxy CAS No. N/A MF Mixture Other Names Epoxy modified thermally and electrically conducti Type Two component Product name Epoxy modified thermally and electrically conducti Material Epoxy adhesives Appearance A:Black paste& B:Light yellow liquid Viscosity A&B 35000 cps Component Two-part Part A& Part B […]

Details

Hardness 1 1 Black Epoxy Resin Self Leveling Two Component with Yellowing Resistance for Electronic Components Potting

Classification Double Components Adhesives Usage Electronics Main Raw Material Silicone EINECS No. 24004253102 CAS No. 67762-94-1 Other Names Thermal Conductive Potting Compound Type Thermal Conductive Glue Main Material Vinyl polysiloxane Application Electrical insulating,LED potting,Automotive,Battery,Pv junction box Feature Higt thermal conductivity,Insulation Advantage Non-toxic,High-temperature resistance,Chemical resistance Shelf life 6 Months MOQ 100kg Mixing Ratio A:B=1:1 OEM/ODM Support […]