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Low Viscosity Two Component Thermal Conductive Epoxy Potting Compound for Electronic Device

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Low Viscosity Two Component Thermal Conductive Epoxy Potting Compound for Electronic Device

Name: Low Viscosity Two Component Thermal Conductive Epoxy Potting Compound for Electronic Device - Rensino Chemical Industrial Co., Ltd
SKU: ER-2191

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Double Components Adhesives	Usage	electronic
Main Raw Material	Epoxy	CAS No.	38891-59-7
Other Names	Epoxy resin	Type	epoxy potting compound
Product name	epoxy potting compound	Application	potting and encapsulation power drive heat sensor
Color	white grey black	Material	epoxy and hardener
Feature	self-leveling	Advantage	thermal conductive epoxy potting
Viscosity	Low Viscosity	Mixing Ratio	A:B=5:1
Thermal conductivity	0.7~2.0	Curing system	reactive curing

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