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Epoxy Compounds for Potting and Encapsulation Low Exothermic Potting Resin Liquid Electrical Insulation Resin Epoxy

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Epoxy Compounds for Potting and Encapsulation Low Exothermic Potting Resin Liquid Electrical Insulation Resin Epoxy

Name: Epoxy Compounds for Potting and Encapsulation Low Exothermic Potting Resin Liquid Electrical Insulation Resin Epoxy - Rensino Chemical Industrial Co., Ltd
SKU: ER-2222

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Classification	Double Components Adhesives	Usage	Construction, Fiber & Garment, Packing, Transportation, led potting
Main Raw Material	Epoxy	EINECS No.	231-072-3
CAS No.	38891-59-7	MF	C15H16O2C2H7ONC3H5OCl
Other Names	epoxy resin AB glue	Type	liquid glue
Color	Clear	Mixing Ratio	5:1
Certificate	ROHS, REACH, PAHS, ASTM, EN-71	Packing	bottle
MOQ	10 KGS	Shelf life	6 Months

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