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HY484 Epoxy Resin Potting Compound Solvent Free Black Self-Leveling Epoxy Potting Adhesive for Circuit Board Encapsulation
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HY484 Epoxy Resin Potting Compound Solvent Free Black Self-Leveling Epoxy Potting Adhesive for Circuit Board Encapsulation

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageembedding electronic components
Main Raw MaterialEpoxyEINECS No.500-033-5
CAS No.38891-59-7MFC15H16O2 C2H7O
Other Namesepoxy potting compoundTypeTwo-components
Product nameTwo-component epoxy potting compoundApplicationelectronic components
Featureself-levelingCharacteristiccold curing
Advantageaging resisitance,moisture resistance,insulationKeywordselectronic adhesive
Full curing time (h)48hardness (S.D)≥80
CertificateROHSREACHServiceSample+OEM+ODM+Private Label
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