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High Reliability Thermal Interface Material 1.5 W/m.K Thermal Conductivity Thermal Conductivity Glue for Photovoltaic Modules
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High Reliability Thermal Interface Material 1.5 W/m.K Thermal Conductivity Thermal Conductivity Glue for Photovoltaic Modules

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageTransportation, LED lamps and lighting assembly
Main Raw MaterialEpoxy resinEINECS No.N/A
CAS No.MIXTUREMFMIXTURE
Other NamesCR TM EPotting-2150RTypeTwo-component
Other NamesThermal Potting AdhesiveLogoJinghe
MaterialEpoxy resinThermal conductivity1.5 W/(m K)
Density@ Cured1.9 g/cm³AppearanceDark grey fluid & translucent fluid
TypeTwo-partUsagePhotovoltaic module
RoHSPassShelf life@ ≤23℃12 months
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