other
FR4 PCB Sheet High Temperature Application High Voltage Copper Clad Epoxy Glass Fiber Resin Clad Laminate
Home  /  Products  /  FR4 PCB Sheet High Temperature Application High Voltage Copper Clad Epoxy Glass Fiber Resin Clad Laminate

FR4 PCB Sheet High Temperature Application High Voltage Copper Clad Epoxy Glass Fiber Resin Clad Laminate

  • Product Detail
We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Rated VoltageExcellentTypeInsulation board
Materialepoxy phenol fiberglassApplicationHigh Voltage
Tensile Strength300MpaColorblack,white,red,green,yellow,grey,blue,yellow etc
NameCopper Clad LaminateApplicationHigh Temperature
CertificationISO9001UseElectrice Power, transformer
Thickness0.2-200mmType3240 epoxy sheet
SamplefreeKeywords3240 epoxy sheet
MOQ10kg
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)
Related Products
Details
Black FR4 G10 V0 Flame Retardant Epoxy Resin Board 1kV-35kV Rated Voltage 180 MPa Tensile Strength for Battery Pack

Rated Voltage 1kV – 35kV Type G10/FR4 Epoxy Glass Cloth Laminate Sheet Material Epoxy Resin + Woven Fiberglass Cloth Application PCB Substrate, Transformer, Motor, Switchgear Mounting Type Cutting, Drilling, CNC Machining Tensile Strength ≥ 180 MPa

Details
FR4 PCB 5×7 7×10 10×15 10×20 15×20 12×18 cm Single Side Copper Clad plate DIY PCB Kit Laminate Circuit Board For Arduino

Type Circuit Board Base Material .. Board Thickness .. Board Size .. Copper Thickness .. Min. Hole Diameter .. Min. Line Width .. Min. Line Spacing .. Surface Finishing ..

Details
Aluminum Based Copper Clad Laminate Sheet CCL for PCB Board IMS Insulated Metal Substrates

Rated Voltage 33 kV Type Insulation Sheet Material aluminum base, copper foil Application High Voltage Tensile Strength 45MPA Model AF & MF Type Copper Clad Laminate Application Material: aluminum base, copper foil Application: Al substrate layer 0.8mm, 1.0mm, 1.2mm, 1.5mm Copper Foil 0.5oz, 1oz,2oz, 3oz, 4oz, 5oz, 6oz Thermal Conductivity k=1.0, k=1.5, k=2.0

Details
EPOXY GLASS BASE Copper Clad Laminate Sheet PCB Raw Material

Type Insulation Sheet Material Fiberglass Application High Temperature Product name Quality-Assured flexible copper clad laminate for fr4 Application Electronics Device Key Words PCB Service One-stop Service Certificate ROHS Trade Term FOB,CIF etc. Payment T/T,L/C,Western Union Port Shanghai Market Global

Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)

Home

Products

about

contact