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EPOXY GLASS BASE Copper Clad Laminate Sheet PCB Raw Material
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EPOXY GLASS BASE Copper Clad Laminate Sheet PCB Raw Material

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

TypeInsulation SheetMaterialFiberglass
ApplicationHigh TemperatureProduct nameQuality-Assured flexible copper clad laminate for fr4
ApplicationElectronics DeviceKey WordsPCB
ServiceOne-stop ServiceCertificateROHS
Trade TermFOB,CIF etc.PaymentT/T,L/C,Western Union
PortShanghaiMarketGlobal
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Contact Form (#3)

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