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Black Epoxy Resins Electronic Potting Glue High Temperature and Waterproof Insulation for Chip Secure
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Black Epoxy Resins Electronic Potting Glue High Temperature and Waterproof Insulation for Chip Secure

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageFiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking, Electronic Potting
Main Raw MaterialEpoxyEINECS No.231-072-3
CAS No.38891-59-7MFC15H16O2C2H7ONC3H5OCl
Other Namesepoxy resin AB glueTypeLiquid Coating
Model588ABShelf life6 Months
Viscosity2000-4000CPSMixing RatioA:B=5:1
ColorBLACKCertificateROHS, REACH, PAHS, ASTM, EN-71
Packagebottle
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