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HY484 Two Component Low Viscosity Potting Sealant Electronic Grade Motor Sealant Potting Epoxy Resin on Electronic Board
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HY484 Two Component Low Viscosity Potting Sealant Electronic Grade Motor Sealant Potting Epoxy Resin on Electronic Board

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

typeAdhesive & Sealantspower sourceMachines
featureSealingapplicationElectronics
Product nameTwo-Component epoxy potting compoundApplicationelectronic components
Main Materialepoxy resinFeatureself-leveling
Characteristiccold curingAdvantageaging resisitance,moisture resistance,insulation
Keywordselectronic adhesiveFull curing time (h)48
hardness (S.D)≥80CertificateROHSREACH
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