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1.5 W/mk Epoxy Resin Potting Compound for Electronics Construction Filling and Sealing Hardener Kit Adhesive

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1.5 W/mk Epoxy Resin Potting Compound for Electronics Construction Filling and Sealing Hardener Kit Adhesive

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Other Adhesives	Usage	Construction, Transportation, Woodworking
Main Raw Material	Epoxy	EINECS No.	210-898-8
CAS No.	61788-97-4	MF	C21H23ClFNO2
Other Names	Epoxy potting sealant	Type	Two component Epoxy potting sealant
Product name	Epoxy potting sealant	Color	Black
Application	Encapsulating and potting of flame retardant	OEM & ODM	Yes, OEM & ODM are Welcome
Packing	25 drum	Advantage	High Quality & Competitive price
Delivery time	10-20days	MOQ	1000kg
Shelf	12months	Thermal Conductivity	1.5w/mk

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