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Electronic Grade Epoxy Potting Resin 1 1 Self leveling Insulation Material for PCB

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Electronic Grade Epoxy Potting Resin 1 1 Self leveling Insulation Material for PCB

Name: Electronic Grade Epoxy Potting Resin 1 1 Self leveling Insulation Material for PCB - Rensino Chemical Industrial Co., Ltd
SKU: ER-4126

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Double Components Adhesives	Usage	widely used
Main Raw Material	Epoxy	CAS No.	4468-64-8
MF	C6H12O	Other Names	epoxy resin
Type	epoxy structural adhesive	Product name	HY411 Epoxy Structural Adhesive
Main material	epoxy	Application	widely use
Color	semi-transparent	Viscosity (Pa.s)	fluid
Full cure time	24h	Pressing shear strength	25 Mpa
Impact strength	18 J	Operating temperature	-60~100
Package	500g/ set

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