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Two-Component Conductive Adhesive High Thermal Conductivity High Adhesion Conductive Epoxy for Semiconductor Target Bonding
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Two-Component Conductive Adhesive High Thermal Conductivity High Adhesion Conductive Epoxy for Semiconductor Target Bonding

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageTransportation, Target binding
Main Raw MaterialEpoxyCAS No.N/A
MFMixtureOther NamesEpoxy modified thermally and electrically conducti
TypeTwo componentProduct nameEpoxy modified thermally and electrically conducti
MaterialEpoxy adhesivesAppearanceA:Black paste& B:Light yellow liquid
Viscosity A&B40000 cpsComponentTwo-part
Part A& Part BEpoxy modified resin & Curing agentMixing RatioA:B=10:1(By Weight)
Hardness shore D65±5Shelf life@ <10℃6 months
ApplicationTarget binding
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