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Manufacturers Heat Conductive Electronic Seal High Hardness Epoxy Resin Potting Adhesive AB Adhesive

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Manufacturers Heat Conductive Electronic Seal High Hardness Epoxy Resin Potting Adhesive AB Adhesive

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Classification	Double Components Adhesives	Usage	PU /Epoxy potting
Main Raw Material	Epoxy	EINECS No.	231-545-4
CAS No.	7085-85-0	MF	mSiO2 nH2O
Other Names	Double Components Adhesives	Type	Liquid
Color	Black	Application	electronic components
Shelf life	12 Months	Epoxy Keywords	Epoxy AB Resin
Epoxy Certificate	ROHS	Epoxy Feature	Moisture-proof, electrical insulation
Mixing ratio (by weight)	A:B=5:1

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