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Epoxy Modified Electrically Conductive Adhesive 2.5 W/m.k EMI Shielding Target Bonding for Sputtering Applications
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Epoxy Modified Electrically Conductive Adhesive 2.5 W/m.k EMI Shielding Target Bonding for Sputtering Applications

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageTransportation, Target binding
Main Raw MaterialEpoxyCAS No.N/A
MFMixtureOther NamesEpoxy modified thermally and electrically conducti
TypeTwo componentProduct nameEpoxy modified thermally and electrically conducti
MaterialEpoxy adhesivesAppearanceA:Black paste& B:Light yellow liquid
Viscosity A&B40000 cpsComponentTwo-part
Part A& Part BEpoxy modified resin & Curing agentMixing RatioA:B=10:1(By Weight)
Hardness shore D65±5Shelf life@ <10℃6 months
ApplicationTarget binding
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