other
Deep Pour Industrial Epoxy Resin and Hardener Potting Compound Electronics Filling Liquid Ab Glue Adhesive Waterproof Sealant
Home  /  Products  /  Deep Pour Industrial Epoxy Resin and Hardener Potting Compound Electronics Filling Liquid Ab Glue Adhesive Waterproof Sealant

Deep Pour Industrial Epoxy Resin and Hardener Potting Compound Electronics Filling Liquid Ab Glue Adhesive Waterproof Sealant

  • Product Detail
We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageelectronic circuit
Main Raw MaterialEpoxyEINECS No.000
CAS No.38891-59-7Other NamesEpoxy Resin and Hardener
TypeEpoxy Potting Compound Circuit BoardsProduct nameEpoxy AB Glue
Colortransparent colourShelf life6 Months
KeywordsEpoxy Resin LiquidPackageCustomized Package
CertificateMSDS RoHSFeatureHigh temperature resistance/Impact resistance
Proportion100:20
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)
Related Products
Details
Three in One Water Based Epoxy Resin Floor Paint Anti Slip Wear Resistant Cement Surface Liquid Coating Two Component

Usage clean room Main Raw Material Epoxy State Liquid Coating CAS No. 61788-97-4 MF Mixture Other Names Epoxy floor coating Fineness ≤ 40 Film hardness (pencil) ≥ 2H Impact resistance (cm) 40 Flexibility (mm) 1 Surface drying time (23±2℃)(h) ≤1 Overall drying time (23±2℃)(h) ≤24 Mixing Ratio Two Component Specification (kg/ group) 25kg/group Certificatie ISO900/ISO14001/ISO45001/CE

Details
Epoxy Resin Hard Clear Liquid Adhesive for Electronics Industrial Coating Insulating Material IC Packaging Guangdong

Classification Other Adhesives Usage Construction, Packing, Transportation Main Raw Material Epoxy Resin EINECS No. 500-004-6 CAS No. 38891-59-7 MF (C11H12O3)n Other Names NAN YA EPOXY RESIN Type Standard Epoxy Resin

Details
5 1 Two Component Electronic Epoxy Moisture Resistant Insulation with Bright Black Finish Epoxy Resin

Classification Double Components Adhesives Usage Woodworking, Construction Main Raw Material Epoxy EINECS No. 500-033-5 CAS No. 9082-00-2 MF C15H16O2C2H7ONC3H5OCl Other Names Epoxy Resin AB Glue Type Epoxy Resin for Electronic Components Potting Mixing Ratio A:B=5:1 Color Black Application Epoxy Resin for Electronic Components Potting Material Epoxy Resin+Hardener Keywords Epoxy Resin Liquid Feature Eco-friendly Shelf life […]

Details
XZX AB High Hardness Crystal Drop Epoxy Resin AB Glue Super Transparent Yellowing Resistant DIY Handmade Shandong Construction

Classification Double Components Adhesives Usage Construction Main Raw Material Epoxy Type Epoxy Resin

Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)

Home

Products

about

contact