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Epoxy Resin Hard Clear Liquid Adhesive for Electronics Industrial Coating Insulating Material IC Packaging Guangdong
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Epoxy Resin Hard Clear Liquid Adhesive for Electronics Industrial Coating Insulating Material IC Packaging Guangdong

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationOther AdhesivesUsageConstruction, Packing, Transportation
Main Raw MaterialEpoxy ResinEINECS No.500-004-6
CAS No.38891-59-7MF(C11H12O3)n
Other NamesNAN YA EPOXY RESINTypeStandard Epoxy Resin
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