what are you looking for?
other
Thermal Conductive Potting Compound FHD EP2530 Epoxy Adhesive 1 1 Ratio Cooling Plate Bonding 48H Cure Time
Home  /  Products  /  Thermal Conductive Potting Compound FHD EP2530 Epoxy Adhesive 1 1 Ratio Cooling Plate Bonding 48H Cure Time

Thermal Conductive Potting Compound FHD EP2530 Epoxy Adhesive 1 1 Ratio Cooling Plate Bonding 48H Cure Time

Inquire Now
Categories
  • Product Detail
We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageConstruction
Main Raw MaterialEpoxyOther NamesEpoxy AB Glue
TypeEpoxy Structural AdhesiveProduct nameEpoxy AB Glue
Color/PartANaturalColor/PartBRed
Mix Ratio1:1Tensile strength10.96 Mpa
Shelflife@25℃6 monthsCure @25℃48 hrs
Cure@100℃150 minThermal Conductivity3 W/mK
Breakdown strength18.26 kV/mm
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)
Related Products
Details
EPotting 2150 1.5 W Epoxy Thermal Conductivity Glue Clear Liquid LED Low Heat Thermal Interface Material

Usage Transportation, LED lamps and lighting assembly Main Raw Material Epoxy resin EINECS No. N/A CAS No. MIXTURE MF MIXTURE Other Names CR TM EPotting-2150 Type Two-component Other Names Thermal Potting Adhesive Logo Jinghe Material Epoxy resin Thermal conductivity 1.5 W/(mK) Density@ Cured 1.9 g/cm³ Appearance Dark grey fluid & Translucent fluid Type Two-part Usage […]

Details
Low Density (2.09g/cm³) Thermal Structural Resin 200+200ml Polyurethane Epoxy Silicone Sealant for Cell-to-Cell Bonding

Classification Other Adhesives Usage Battery Main Raw Material Polyurethane EINECS No. Unspecified CAS No. Reference to MSDS MF Mixture Other Names PU Adhesive Sealant Type PU Adhesive Sealant Color A (Base agent): Blue B (Curing agent): White Volume 200ml+200ml, 200L+200L. Shelf life 9Months Free sample Available OEM/ODM Acceptable Certificate ISO9001 / ISO/TS16949/ISO14001 Delivery time 10-30 […]

Details
High Thermal Conductivity Removable Structural Adhesive Silicone Free Gap Epoxy Resin for New Energy Vehicle Battery Cells

Classification Other Adhesives Usage Transportation, Electronic vehicle and Energy Storage Main Raw Material Polyurethane EINECS No. 210-898-8 CAS No. 9009-54-5 MF CH3H8N2O Other Names Electronic potting sealant Type Two component Usage Thermally conductive gap filler Color CUSTOMIZED Material Polyurethane Mix rate 1:1 Application Electronic vehicle and Energy Storage battery Advantage 1.2W; 1.5W; 2W Thermally conductivity […]

Details
HY484D Black Thermal Conductive Epoxy Potting Compound for Led

Classification Double Components Adhesives Usage electronic Main Raw Material Epoxy CAS No. 38891-59-7 Other Names Epoxy resin Type epoxy potting compound Product name epoxy potting compound Application potting and encapsulation power drive heat sensor Color white grey black Material epoxy and hardener Feature self-leveling Advantage thermal conductive epoxy potting Viscosity Low Viscosity Mixing Ratio A:B=5:1 […]
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)

Home

Products

about

contact