other
HR Fast Defoaming Clear Epoxy Encapsulating Glue for Electronic Parts Acid Alkali Resistant Waterproof Potting Adhesive
Home  /  Products  /  HR Fast Defoaming Clear Epoxy Encapsulating Glue for Electronic Parts Acid Alkali Resistant Waterproof Potting Adhesive

HR Fast Defoaming Clear Epoxy Encapsulating Glue for Electronic Parts Acid Alkali Resistant Waterproof Potting Adhesive

  • Product Detail
We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageConstruction + Electronics
Main Raw MaterialEpoxyProduct nameEpoxy Potting Glue
KeywordsEpoxy adhesive seriesApplicationLED lamp, transparent power supply module
Factory advantageStable outputAdvantageExcellent adhesion performance, Available for repacking
Delivery time7-15 DaysOne set50kg
Test ReportRoHS,FDA,REACH,TSCA,Content per set25kg per Component A & Component B per set
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)
Related Products
Details
Epoxy Resin Diluent Butyl Glycidol Ether for Potting Materials

Usage Powder Coating Main Raw Material Epoxy Reactive Diluent EINECS No. 218-746-2 CAS No. 2224-15-9 MF C8h14o4 Construction method Brush Component Butyl Glycidol Ether) Formation mechanism Conversion type Epoxy Equivalent(G/EQ) 125-143 Hydrolysable Chlorine, Wt% 0.71 Max Inorganic Chlorine 0.0036 Max Packing Iron drum

Details
0.5 W mk Black Color Resin Epoxy Two Component Potting Glue for Construction and Woodworking Electrical Potting Compound

Classification Other Adhesives Usage Construction, Transportation, Woodworking Main Raw Material Epoxy EINECS No. 210-898-8 CAS No. 61788-97-4 MF C21H23ClFNO2 Other Names Epoxy potting sealant Type Two component Epoxy potting sealant Product name Epoxy potting sealant Color Black Application Encapsulating and potting of flame retardant OEM & ODM Yes, OEM & ODM are Welcome Packing 25 […]

Details
9216F APG Epoxy Resin Potting Compound for Electricity Insulation Parts Usage

Classification Double Components Adhesives Usage Electrical insulation Main Raw Material Epoxy EINECS No. 216-823-5 CAS No. 1675-54-3 MF C21H24O4 Other Names Epoxy resin potting compound Type Epoxy Resin Compound Keywords Epoxy Resin Liquid

Details
Virgin POM Copolymer Resin Pellets High Toughness Injection Molding Engineering Plastic Raw Material

Product Type Synthetic Resin And Plastics CAS No. 9002-81-7 Purity >99.0% MF (CH2O)n Other Names Polyoxymethylene, Acetal Resin, POM

Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)

Home

Products

about

contact