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High Thermal Conductivity Aluminum Nitride AlN Ceramic Metallized Substrate Board with DPC AMB Thick Copper Cladding
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High Thermal Conductivity Aluminum Nitride AlN Ceramic Metallized Substrate Board with DPC AMB Thick Copper Cladding

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

MaterialAluminum NitridApplicationIndustrial Ceramic
TypeCeramic PlatesShapePlate
Processing ServiceCutting, WELDING, mouldingMaterialHigh-Purity Aluminum Nitride (AlN) Powder
Thermal Conductivity170 – 230 W/m*K (Typical ≥ 200 W/m*K)Volume Resistivity> 10 13 Ω*cm
Breakdown Strength> 15 kV/mmCoefficient of Thermal Expansion (CTE)4.5 – 5.0 ppm/°C
Bending Strength≥ 380 MPaDensity3.33 g/cm³
Operating Temperature-55℃ ~ 800℃CertificateISO9001 ROHS CE
SizeCustomer's Drawing
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