We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.
| Classification | Double Components Adhesives | Usage | Electronic Components |
| Main Raw Material | Epoxy Resin | EINECS No. | 500-033-5 |
| CAS No. | 25068-38-6 | Other Names | Epoxy Potting Compound |
| Type | Two-Component | Material Type | Two-component Epoxy Resin |
| Mixing Ratio | 5:1 (A:B by Weight) | Density after mixing | 1.65±0.05 g/cm3 |
| Hardness (Shore D) | 85 ± 5 D | Mixed Viscosity | 1000-2000 mPa.s |
| Thermal Conductivity | ≥0.3 W/m.K | Dielectric Strength | 19 kV/mm |
| Service Temperature | -50°C to 120°C | Volume Shrinkage | 0.89% |
| Compliance | RoHS, REACH, VOC Certified |