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Two Component Epoxy Resin Non corrosive Insulating Sealant Epoxy Glue for Electronics
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Two Component Epoxy Resin Non corrosive Insulating Sealant Epoxy Glue for Electronics

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ClassificationDouble Components AdhesivesUsageembedding electronic components
Main Raw MaterialEpoxyEINECS No.500-033-5
CAS No.38891-59-7MFC15H16O2 C2H7O
Other Namesepoxy potting compoundTypeTwo-components
Product nameTwo-Component epoxy potting compoundApplicationelectronic components
Main Materialepoxy resinFeatureself-leveling
Advantageaging resisitance,moisture resistance,insulationKeywordselectronic adhesive
Full curing time (h)48hardness (S.D)≥80
CertificateROHSREACH
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