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Transparent Soft Silicone Epoxy Resin Curing Agent Double Components AB Glue Fast Curing Circuit Board Packaging Potting Process

Home / Products / Transparent Soft Silicone Epoxy Resin Curing Agent Double Components AB Glue Fast Curing Circuit Board Packaging Potting Process

Transparent Soft Silicone Epoxy Resin Curing Agent Double Components AB Glue Fast Curing Circuit Board Packaging Potting Process

Name: Transparent Soft Silicone Epoxy Resin Curing Agent Double Components AB Glue Fast Curing Circuit Board Packaging Potting Process - Rensino Chemical Industrial Co., Ltd
SKU: ER-0592

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Double Components Adhesives	Usage	Packing
Main Raw Material	Epoxy	Type	AB glue

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