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SE685 2 Part AB Epoxy Resin Adhesive Potting High Tensile Strength Epoxy Glue for Electronics
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SE685 2 Part AB Epoxy Resin Adhesive Potting High Tensile Strength Epoxy Glue for Electronics

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationOther AdhesivesUsageTransportation, Electronic
Main Raw MaterialPolyurethaneEINECS No.210-898-8
CAS No.9009-54-5MFCH3H8N2O
Other NamesElectronic potting sealantTypeTwo component
UsageElectronic pottingColorLight yellow transparent
MaterialEpoxyMix rate100:13
ApplicationElectronic, PCB, IGBT, ChargingAdvantageElastic, weather resistant
OEM & ODMFree OEM & ODM serviceSamplesFree samples
Packing25kg BUCKET
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