We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.
| Classification | Double Components Adhesives | Usage | Electronic |
| Main Raw Material | Epoxy | CAS No. | 38891-59-7 |
| MF | C20H28ClNO4 | Other Names | EP (epoxy resin) |
| SAMPLE | FREE SAMPLE | Other Names | Epoxy Resin and Hardener |
| Package | Customized Package | Type | Epoxy Potting Compound Circuit Boards |
| Certificate | ISO COA MSDS ROHS | Quality | High-Quality |
| Colour | Translucent Clear | Service | OEM ODM PRIVATE LABEL |