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RoHS Compliant Thermal Potting Material Good Substrate Adhesion Shock Resistance Epoxy Compound for Photovoltaic Modules
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RoHS Compliant Thermal Potting Material Good Substrate Adhesion Shock Resistance Epoxy Compound for Photovoltaic Modules

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TypeOtherMaterialSilicone
ApplicationOtherTensile Strengthliquid
Product namethermal potting adhesiveApplication rangePotting of fiber optic cable boxes,electronic components
Main MaterialLiquid silicone adhesiveMixing Ratio(weight ratio)A:B=1:1
Density@ Cured1.9 g/cm³AdvantageElectrically insulative
PeculiarityGood substrate adhesion, ideal for potting and encapsulationStorage condition≤23℃
Shelf life12 monthsHardness, ±558 Shore A
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