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Resin Sealant Glue AB Glue Epoxy Potting Compound Adhesive for Electronic Potting Casting Encapsulation

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Resin Sealant Glue AB Glue Epoxy Potting Compound Adhesive for Electronic Potting Casting Encapsulation

Name: Resin Sealant Glue AB Glue Epoxy Potting Compound Adhesive for Electronic Potting Casting Encapsulation - Rensino Chemical Industrial Co., Ltd
SKU: ER-4115

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Other Adhesives	Usage	Construction
Main Raw Material	Epoxy	EINECS No.	231-525-8
CAS No.	69852-05-02	MF	mSiO25OnH2O
Other Names	Double Components Adhesives	Type	Two Component
Product name	Epoxy Electrical Potting Compound	Colors	Transparent
Shelf life	6 Months/quality Guarantee	Application	Relays, Controllers, Power Modules, Sensors
Customized service	Support OEM & ODM	Use	LED, Automotive Electronics, Regulators, Industrial Electronics
Function	flame retardancy, thermal conductivity, excellent flowability	Feature	Strong adhesion, long-lasting hold, Non Toxic
Temperature Resistance	– 50 to 130°C	Certificates	CE, ROHS, Reach,etc

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