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Resin and Hardner Epoxy Potting Compounds for Electronic Components High Temperature Epoxy Resin
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Resin and Hardner Epoxy Potting Compounds for Electronic Components High Temperature Epoxy Resin

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsagePU /Epoxy potting
Main Raw MaterialEpoxyEINECS No.231-545-4
CAS No.7085-85-0MFmSiO2 nH2O
Other NamesDouble Components AdhesivesTypeLiquid
ColorBlackApplicationelectronic components
Shelf life12 MonthsEpoxy KeywordsEpoxy AB Resin
Epoxy CertificateROHSEpoxy FeatureMoisture-proof, electrical insulation
Mixing ratio (by weight)A:B=5:1
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